Radisys Corporation is a well-known global leader of open telecom solutions which just announced the launch of its Connect RAN 5G IoT software stack.

The new stack will support diverse IoT use cases from low-cost, low battery device driven deployments like metering and asset tracking to mission-critical, ultra-low latency, time-sensitive industrial deployments, and XR, Video Surveillance, and wearables deployments.

In fact, the Connect RAN 5G IoT software enables rapid time-to-market for new use cases, while lowering the upfront CAPEX spend. The resulting acceleration of the RoI is a significant benefit for the entire 5G ecosystem. For mobile operators, the 5G IoT software stack delivers new enhancements in functionality, coverage, latency, low power consumption, reliability and ease of deployment.

Munish Chhabra, SVP and general manager, Software and Services, Radisys, commented:

“We are excited to launch our 3GPP compliant Connect RAN 5G IoT Software Suite, providing our customers with an industry-leading, feature-rich stack that meets the multitude requirements of IoT solutions and networks based on 5G. With this launch, Radisys continues to maintain its leadership in delivering multi-platform, standards-based 5G software with flexible deployment options to our customers enabling them to address the diverse IoT markets.”

Connect RAN 5G IoT software suite Highlights

  • The feature unlocks the full potential of 5G by enabling new business models for OEMs and service providers to deliver a variety of IoT services. It offers  advanced positioning support  and enables different 5G IoT use cases by offering features including NB-IoT and eMTC/LTE-M based on LTE waveform and uRLLC, NR-lite / RedCap and eMBB based on NR waveform.
  • It provides an exhaustive list of 5G RAN technology enablers for both Terrestrial and Non-terrestrial (SATCOM) networks, to meet the diverse demands of IoT solutions through a single RAN base.
  • It also provides software deployment flexibility including different CU-UP deployments – with / without E1 Split, CU-DU Architecture Split options – AiO, CU-DU Option-2/6 split, DU-RU Option-7.x split, across different platforms and form-factors for both indoor and outdoor solutions.
  • It enables OEMs, ODMs and operators to cost-effectively develop and deploy IoT solutions.
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Nikoleta Yanakieva Editor at DevStyleR International
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